Genitec Fully Automatic Positioning PCB Laser Cutting Machine UV Laser Cutter for SMT ZMLS5000DP
Fully Automatic Positioning PCB Laser Cutting Machine UV Laser Laser Cutter Machine
PCB Laser Cutting Machine Description:
1. PCB Laser Cutting Machine is equipped with control software with independent intellectual property rights,
user-friendly interface, complete functions, simple operation;
2. can process any graphics, cutting different thicknesses and different materials can be processed
and the synchronization is complete hierarchical;
optical system design optimization to ensure high beam quality, reduce the focused spot size, to ensure precision;
3. using high-performance UV laser with wave length, high beam quality, higher peak power characteristics.
Due to ultraviolet light through decomposition, vaporization rather than melting materials processing to achieve,
so almost no post-processing glitches, small thermal effect, no points;
Layer, the effect of cutting precision, smooth, steep sidewalls.
4. PCB Laser Cutting Machine is using vacuum fixed sample, no mold protection plate is fixed,
convenient, improve processing efficiency.
5. PCB Laser Cutting Machine can cut a variety of substrate materials, such as: silicon, ceramic, glass and the like.
6. automatic correction, automatic positioning function, multi-plate cutting, automatic thickness measurement
and compensation, motor Bank and compensation, working better uniformity and small machining depth fluctuations,
higher processing efficiency of complex graphics;
FPC UV laser cutting machine, FPC laser cutting machine Technical parameters:
Solid-state UV laser source laser wavelength: 355nm.
PCB Laser Cutting Machine Features
1. MicroScan 5000DP laser cutting machine, dual platform, greatly improve production efficiency,
is specially designed for FPC and PCB processing equipment.
2. Efficient and fast FPC/PCB shape cutting, drilling and covering film window opening,
fingerprint identification chip cutting, TF memory card board, mobile phone camera module cutting and other applications.
3. Block, layer, designated block or selected area cutting and direct molding, cutting edge neat round,
smooth no burr, no glue overflow.
The product can be arranged in multiple matrix for automatic positioning and cutting, especially suitable for fine,
difficult, complex patterns and other shapes of cutting.
4. High performance laser: the use of international first-line brand solid-state ultraviolet laser/green laser,
with good beam quality, focusing spot small, power distribution uniform, small thermal effect, slit width small,
cutting quality high advantages is the guarantee of perfect cutting quality.
5. Fast and high precision: the combination of high precision, low drift vibroscope and fast coreless linear motor system
enables fast cutting while maintaining high precision on the micron scale.
6. Fully automatic positioning: the use of high-precision CCD automatic positioning, focusing,
so that the positioning fast,accurate and high precision, without manual intervention, simple operation,
to achieve the same type of one-button mode,greatly improve the production efficiency.
7. Waste gas treatment system: suction system can eliminate all cutting waste gas,
avoid the harm to the operator and environmental pollution.
8. High degree of automation: vibration mirror automatic correction, automatic focus, the whole process of automation,
the use of laser displacement sensor to automatically adjust the height of the focus to the table,
to achieve rapid alignment, save time and worry.
9. Simple and easy to learn software: independently developed control software based on Windows system,
easy to operate Chinese interface, friendly and beautiful, powerful and diverse functions, simple and convenient operation.
|Power supply||Single Phase AC220V/3KW|
|Laser source||PS Laser/NS Laser||NS Laser|
|Laser power||15W/30W (Optional)||15W/20W (Optional)|
|Material thickness||≦1.6mm (According to material)|
|Whole machine precision||±20 μm|
|positioning precision||±2 μm|
|Repeat precision||±2 μm|
|Focus spot diameter||20 ± 5 μm|
|Environment temperature/humidity||20±2 °C/<60%|
|Machine tool body||Marble|
|Galvanometer system||Original imported|
|Motion controlling system||Original imported|
|Formats||Gerber,DXF, ASCII, Excellon I and II, Sieb&Meier|
|Necessary hardware and software||Including PC and CAM software|
|Working mode||Manual loading and unloading||Automatic loading and unloading cutting processing||Manual loading and unloading|