Genitec 20μm PCB Laser Cutting Machine for SMT ZMLS5000DP
1 pcs
MOQ
USD2000-90000
Price
Genitec 20μm PCB Laser Cutting Machine for SMT ZMLS5000DP
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Features
Basic Infomation
Place of Origin: China
Brand Name: Genitec
Certification: CE, RoHS
Model Number: ZMLS5000DP
High Light:

20μm PCB Laser Cutting Machine

,

15W PCB Laser Cutting Machine

,

20μm cnc laser cutting machine

Payment & Shipping Terms
Packaging Details: Vacuum packed in wooden cases
Delivery Time: 5-45 days
Payment Terms: L/C, T/T, Western Union, MoneyGram
Supply Ability: 500 pcs per Month
Specifications
Type: ZMLS5000DP
Machine Name: Comfortable White PCB Automatic Laser Cutting Machine For FPC/ PCB ZMLS6000PII
Machine Size: 1680*1650*1800mm
Product Weight: 2000KG
Voltage: Single Phase AC220V/3KW
Laser Source: PS Laser/NS Laser
Processing Size: 650mm*650mm
Laser Power: 15W/20W (Optional)
Programme 1: Whole PCB Scanning Function
Programme 2: Offline Program Function
Product Description

Genitec 20μm PCB Laser Cutting Machine for SMT ZMLS5000DP

High Accuracy Aluminum Laser Cutting Machine For FPC/ PCB Cutting ZMLS5000DP

 

 

Product Description

 

1. With control software with independent intellectual property rights, user-friendly interface,

 

    complete functions, simple operation;


2. Can process any graphics, cutting different thicknesses and different materials can be processed

 

    and the synchronization is complete hierarchical; optical system design optimization to ensure high beam quality,

 

    reduce the focused spot size, to ensure precision;


3. Using high-performance UV laser with wave length, high beam quality, higher peak power characteristics.

 

    Due to ultraviolet light through decomposition, vaporization rather than melting materials processing to achieve,

 

    so almost no post-processing glitches, small thermal effect, no points.


    Layer, the effect of cutting precision, smooth, steep sidewalls.


4. Using vacuum fixed sample, no mold protection plate is fixed, convenient, improve processing efficiency.


5. Can cut a variety of substrate materials, such as: silicon, ceramic, glass and the like.


6. Automatic correction, automatic positioning function, multi-plate cutting,

 

    automatic thickness measurement and compensation, motor Bank and compensation,

 

    working better uniformity and small machining depth fluctuations, higher processing efficiency of complex graphics.


    FPC UV laser cutting machine, FPC laser cutting machine Technical parameters:


    Solid-state UV laser source laser wavelength: 355nm

 

 

Specification

 

Item ZMLS5000DP
Machine size(L*W*H) 1680*1650*1800mm
Weight 2000KG
Power supply Single Phase AC220V/3KW
Laser source PS Laser/NS Laser
Laser power 15W/20W (Optional)
Material thickness ≦1.6mm (According to material)
Whole machine precision ±20 μm
positioning precision ±2 μm
Repeat precision ±2 μm
Processing size 350mm*450mm*2
Focus spot diameter 20 ± 5 μm
Environment temperature/humidity 20±2 °C/<60%
Machine tool body Marble
Galvanometer system Original imported
Motion controlling system Original imported
Formats Gerber,DXF, ASCII, Excellon I and II, sieb&Meier
Necessary hardware and software Including PC and CAM software
Working mode Manual loading and unloading

 

1. MicroScan5000DP laser cutting machine, dual platform, greatly improve production efficiency,

 

    is specially designed for FPC and PCB processing equipment.


2. Efficient and fast FPC/PCB shape cutting, drilling and covering film window opening,

 

    fingerprint identification chip cutting, TF memory card board, mobile phone camera module cutting and other applications.


3. Block, layer, designated block or selected area cutting and direct molding, cutting edge neat round,

 

    smooth no burr, no glue overflow.

 

4. The product can be arranged in multiple matrix for automatic positioning and cutting,

 

    especially suitable for fine, difficult, complex patterns and other shapes of cutting.

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