Genitec 20μm PCB Laser Cutting Machine for SMT ZMLS5000DP
High Accuracy Aluminum Laser Cutting Machine For FPC/ PCB Cutting ZMLS5000DP
1. With control software with independent intellectual property rights, user-friendly interface,
complete functions, simple operation;
2. Can process any graphics, cutting different thicknesses and different materials can be processed
and the synchronization is complete hierarchical; optical system design optimization to ensure high beam quality,
reduce the focused spot size, to ensure precision;
3. Using high-performance UV laser with wave length, high beam quality, higher peak power characteristics.
Due to ultraviolet light through decomposition, vaporization rather than melting materials processing to achieve,
so almost no post-processing glitches, small thermal effect, no points.
Layer, the effect of cutting precision, smooth, steep sidewalls.
4. Using vacuum fixed sample, no mold protection plate is fixed, convenient, improve processing efficiency.
5. Can cut a variety of substrate materials, such as: silicon, ceramic, glass and the like.
6. Automatic correction, automatic positioning function, multi-plate cutting,
automatic thickness measurement and compensation, motor Bank and compensation,
working better uniformity and small machining depth fluctuations, higher processing efficiency of complex graphics.
FPC UV laser cutting machine, FPC laser cutting machine Technical parameters:
Solid-state UV laser source laser wavelength: 355nm
|Power supply||Single Phase AC220V/3KW|
|Laser source||PS Laser/NS Laser|
|Laser power||15W/20W (Optional)|
|Material thickness||≦1.6mm (According to material)|
|Whole machine precision||±20 μm|
|positioning precision||±2 μm|
|Repeat precision||±2 μm|
|Focus spot diameter||20 ± 5 μm|
|Environment temperature/humidity||20±2 °C/<60%|
|Machine tool body||Marble|
|Galvanometer system||Original imported|
|Motion controlling system||Original imported|
|Formats||Gerber,DXF, ASCII, Excellon I and II, sieb&Meier|
|Necessary hardware and software||Including PC and CAM software|
|Working mode||Manual loading and unloading|
1. MicroScan5000DP laser cutting machine, dual platform, greatly improve production efficiency,
is specially designed for FPC and PCB processing equipment.
2. Efficient and fast FPC/PCB shape cutting, drilling and covering film window opening,
fingerprint identification chip cutting, TF memory card board, mobile phone camera module cutting and other applications.
3. Block, layer, designated block or selected area cutting and direct molding, cutting edge neat round,
smooth no burr, no glue overflow.
4. The product can be arranged in multiple matrix for automatic positioning and cutting,
especially suitable for fine, difficult, complex patterns and other shapes of cutting.