Compared with single-platform laser machine, ZMLA5000DP the single-head dual-platform switching processing method saves time
for board replacement, realizes non-stop work, and greatly improves production efficiency. It is a special tailored for
PCB/FPC processing and replaces the traditional single-platform laser machine.
1.The gantry structure and flying light path design make it easy to connect to the production line.
2. It can be equipped with a special loading and unloading IN-LINE system according to production needs to realize
automatic production and greatly improve production efficiency. It is a device tailored for FPC and PCB processing.
3.The working mode of the ordinary cutting machine can realize assembly line operation and double-station production,
the smart model design,the closed optical path system can process products within450,which can be separated into a
double platform 200 range,it is tailor-made for FPC and PCB processing.
Easy Drill professional, friendly and simple cutting software
While simplifying the processing steps of the cutting operation, the efficiency is improved, the operation is intuitive and simple,
the file is transferred, and the corresponding parameter is selected from the expert parameter database to start cutting.
The simple and friendly interface, the menu is clear and easy to understand, and the operators are prompted one by one to
complete the processing task.
UV Laser reduces operating costs
High-power, stable, reliable, and field-replaceable UV lasers can be maintained at a lower cost than their counterparts.
Solid State Cooling System
Built-in Thermo Rack cycle cold-confirmed semiconductor refrigerator, small size, light weight, safe and reliable, high efficiency,
high temperature control accuracy, low noise
CCD positioning system
High-precision CCD positioning system realizes automatic positioning and focusing, making positioning fast and accurate,
and improving work efficiency.
|Power supply||Single Phase AC220V/3KW|
|Laser source||PS Laser/NS Laser|
|Laser power||15W/20W (Optional)|
|Material thickness||≦1.6mm (According to material)|
|Whole machine precision||±20 μm|
|positioning precision||±2 μm|
|Repeat precision||±2 μm|
|Focus spot diameter||20 ± 5 μm|
|Environment temperature/humidity||20±2 °C/<60%|
|Machine tool body||Marble|
|Galvanometer system||Original imported|
|Motion controlling system||Original imported|
|Formats||Gerber,DXF, ASCII, Excellon I and II, sieb&Meier|
|Necessary hardware and software||Including PC and CAM software|
|Working mode||Manual loading and unloading|