Genitec PS NS PCB Laser Cutting Machine AC220V FPC Laser Cutting Engraving Machine for SMT ZMLS5000DP
1 set
MOQ
USD2000-90000
Price
Genitec PS NS PCB Laser Cutting Machine AC220V FPC Laser Cutting Engraving Machine for SMT ZMLS5000DP
Features Gallery Product Description Request A Quote
Features
Basic Infomation
Place of Origin: China
Brand Name: Genitec
Certification: CE, RoHS
Model Number: ZMLS5000DP
High Light:

NS PS PCB Laser Cutting Machine

,

PCB Laser Cutting Machine AC220V

,

FPC Laser Cutting Engraving Machine

Payment & Shipping Terms
Packaging Details: Vacuum packed in wooden cases
Delivery Time: 5-45 days
Payment Terms: L/C, T/T, Western Union, MoneyGram
Supply Ability: 500 sets per Month
Specifications
Product Name: ZMLS5000DP
Machine Name: PCB Laser Cutting Machine
Machine Size: 1680*1650*1800mm
Product Weight: 2000KG
Voltage: Single Phase AC220V/3KW
Laser Source: PS Laser/NS Laser
Processing Size: 650mm*650mm
Laser Power: 15W/20W (Optional)
Product Description

Genitec PS NS PCB Laser Cutting Machine AC220V FPC Laser Cutting Engraving Machine for SMT ZMLS5000DP

 

 

PCB Laser Cutting Machine Description

 

1. With control software with independent intellectual property rights, user-friendly interface, complete functions, simple operation;


2. Can process any graphics, cutting different thicknesses and different materials can be processed

 

    and the synchronization is complete hierarchical; optical system design optimization to ensure high beam quality,

 

    reduce the focused spot size, to ensure precision;

 

3. Automatic correction, automatic positioning function, multi-plate cutting, automatic thickness measurement and compensation,

 

    motor Bank and compensation, working better uniformity and small machining depth fluctuations,

 

    higher processing efficiency of complex graphics.


4. FPC UV laser cutting machine, FPC laser cutting machine Technical parameters:

 

   Solid-state UV laser source laser wave length: 355nm

 

5. Using vacuum fixed sample, no mold protection plate is fixed, convenient, improve processing efficiency.


6. Can cut a variety of substrate materials, such as: silicon, ceramic, glass and the like.


7. Using high-performance UV laser with wave length, high beam quality, higher peak power characteristics.

 

    Due to ultraviolet light through decomposition, vaporization rather than melting materials processing to achieve,

 

    so almost no post-processing glitches, small thermal effect, no points Layer, the effect of cutting precision, smooth, steep sidewalls.

 

 

Some Advantages


No mechanical stress


Lower tooling costs

 

Design versatility—simple software changes enable application changes


Works with any surface—Teflon, ceramic, aluminum, brass and copper


Fiducial recognition achieves precise, clean cuts


Higher quality of cuts


No consumables


Optical recognition improves product quality

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Tel : +86-13929264317
Fax : 86-0769-82855028
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