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About Seprays
Founded in Taiwan(Genitec) in 1993, Seprays focuses on technological R&D and innovation. In 2002, it established a branch in Dongguan (which was upgraded and reorganized into a subsidiary in 2013), fully responsible for R&D, production, sales, and after-sales technical training services, ensuring rapid response and comprehensive support for customer needs. To further expand production, in 2003, it purchased nearly 20 acres of land in Zhejiang Province and established a 20,000-square-meter modern industrial plant, thereby increasing production capacity and manufacturing capabilities.
Seprays has been dedicated to the PCB/FPC depaneling field for over 30 years. Its main products include milling cutter depanelers, laser depanelers, V-groove depanelers, and stamping depanelers, as well as automated loading and unloading solutions for the front and rear ends of depaneling, including plate placement. It is a high-tech enterprise integrating R&D, production, sales, and service.
Seprays provides a complete line of equipment services to Fortune Global 500 and China’s Top 500 companies, including Foxconn, Flextronics, State Grid, Luxshare, Compal, Wistron, Bosch, China Electronics, Quanta Computer, CRRC Corporation Limited, China Aerospace Science and Technology Corporation, OPPO, and ZTE, as well as small and medium-sized enterprises. Seprays’ complete panel separation lines are widely used in factories both domestically and internationally.
Service For Global
PCB Depaneling Total Solution
31
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33
Years of experience in SMT industrial equipment manufacturing
180+
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PCB Depaneling Insights & Manufacturing News
SEPRAYS at NEPCON ASIA 2026: Connecting Through PCB Depaneling and Automation
October 27–29, 2026 | Shenzhen, China SEPRAYS is participating in NEPCON ASIA 2026, taking place October 27-29 at the Shenzhen World Exhibition & Convention Center. At Hall 13, Booth 13F76, the event provides an opportunity to connect with electronics manufacturing professionals and exchange perspectives on PCB depaneling, production automation, and evolving manufacturing requirements. Exploring PCB Depaneling and Automation As electronic products become increasingly compact and complex, PCB separation remains an important consideration in electronics manufacturing. Different production environments require different approaches to depaneling. Factors such as board design, component placement, production volume, processing accuracy, and manufacturing workflow can all influence the choice of separation technology. Laser depaneling and automated mechanical separation offer different advantages depending on the application. Understanding these
How to Reduce PCB Depaneling Stress Around Sensitive Components
PCB depaneling stress is easy to overlook until a production line starts seeing cracked ceramic capacitors, unstable solder joints, or unexplained failures during reliability testing. For manufacturers producing compact, high-density electronic assemblies, separating boards is not just a cutting operation. It is part of quality control. The challenge becomes more serious when components sit close to the board edge. A small amount of bending or vibration can create problems that are difficult to detect during routine inspection. 🔍 1. Which Components Are Most at Risk? Not every component responds to separation forces in the same way. Multilayer ceramic capacitors (MLCCs), fine-pitch packages, BGAs, and heavy connectors deserve particular attention. Common warning signs include: The damage may not appear immediately after
NEPCON ASIA 2026: Connecting the Electronics Manufacturing Industry
NEPCON ASIA 2026 is scheduled to take place from October 27 to 29, 2026, at the Shenzhen World Exhibition & Convention Center in Shenzhen, China. As an industry event focused on electronics manufacturing, NEPCON ASIA provides a platform for professionals to explore developments in surface mount technology (SMT), printed circuit board (PCB) processing, production automation, and related manufacturing technologies. As electronics products continue to evolve, manufacturers face ongoing challenges in improving production efficiency, maintaining consistent quality, and adapting to increasingly sophisticated manufacturing requirements. Industry exhibitions offer opportunities to learn about emerging technologies, exchange technical insights, and better understand changing production needs. Event Information The exhibition is an opportunity to follow developments across the electronics manufacturing ecosystem and learn how new
Dual-Spindle PCB Depaneling for Higher Production Efficiency and Automated Tray Loading
Dual-spindle PCB depaneling is worth considering when a production line needs more output but cannot afford extra manual handling or a larger workstation footprint. In electronics manufacturing, cutting is only part of the cycle. Boards still need to be positioned, separated, collected, and transferred to the next process. When these steps fall behind, a fast machine alone will not solve the bottleneck. 🔍 Why Does Production Slow Down? Imagine an overseas semiconductor-related electronics manufacturer producing assembled circuit boards for industrial or consumer electronics. Orders are increasing, but operators spend too much time moving panels, unloading finished boards, and preparing the next cycle. The cutting machine may be capable of working faster, yet the overall line remains constrained by handling time.
Seprays — Your PCB Depaneling Expert.
Because we know that even the best products are only as strong as the people behind them.
That’s why we provide 24/7 expert technical support—whenever and wherever you need it.
