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About Seprays
Founded in Taiwan(Genitec) in 1993, Seprays focuses on technological R&D and innovation. In 2002, it established a branch in Dongguan (which was upgraded and reorganized into a subsidiary in 2013), fully responsible for R&D, production, sales, and after-sales technical training services, ensuring rapid response and comprehensive support for customer needs. To further expand production, in 2003, it purchased nearly 20 acres of land in Zhejiang Province and established a 20,000-square-meter modern industrial plant, thereby increasing production capacity and manufacturing capabilities.
Seprays has been dedicated to the PCB/FPC depaneling field for over 30 years. Its main products include milling cutter depanelers, laser depanelers, V-groove depanelers, and stamping depanelers, as well as automated loading and unloading solutions for the front and rear ends of depaneling, including plate placement. It is a high-tech enterprise integrating R&D, production, sales, and service.
Seprays provides a complete line of equipment services to Fortune Global 500 and China’s Top 500 companies, including Foxconn, Flextronics, State Grid, Luxshare, Compal, Wistron, Bosch, China Electronics, Quanta Computer, CRRC Corporation Limited, China Aerospace Science and Technology Corporation, OPPO, and ZTE, as well as small and medium-sized enterprises. Seprays’ complete panel separation lines are widely used in factories both domestically and internationally.
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Years of experience in SMT industrial equipment manufacturing
180+
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GAM385AT+ Tray Loading Machine for Automotive Electronics Automated PCB Sorting and Inspection
GAM385AT+ Tray Loading Machine solutions are becoming increasingly important in automotive electronics manufacturing.Not because factories simply want more automation.But modern PCB production lines can no longer afford unstable handling, manual sorting mistakes, or inconsistent inspection flow. In 2026, automotive electronics production is moving faster than ever. At the same time, manufacturers are facing: This is why automated PCB sorting and inspection systems are no longer optional for many SMT factories. They are becoming part of the core production strategy. 🚗 Why Automotive PCB Production Needs Automated Sorting Automotive electronics are different from standard consumer products. A small PCB defect can lead to: That changes how factories think about depaneling and inspection. In older production lines, operators manually handled: That process

How to Choose the Right PCB Separation Method for Your Production Line
Selecting a PCB separation method has become a much bigger decision in 2026 than many factories expected.A few years ago, many manufacturers chose the lowest-cost depaneling machine available. Now the situation is different. Smaller components.Higher-density boards.Faster SMT lines.More EV and automotive projects.And tighter yield requirements. The wrong depaneling process can quietly increase: In many cases, the separation method affects SMT yield more than the cutting speed itself. So how do you actually choose the right PCB separation method for your production line? Let’s break it down from a real production perspective. 🔍 Why PCB Separation Is No Longer “Just a Cutting Step.” In older SMT factories, depaneling was often treated as a simple downstream operation. But modern electronics production changed

GAM336AT + ZM830 Automated PCB Depaneling Solution for Automotive Tire Pressure Sensors
Automotive electronics manufacturers are under constant pressure in 2026.Higher production volumes.Smaller PCB designs.Stricter quality requirements. For products like Tire Pressure Monitoring System (TPMS) sensors, stable PCB depaneling and automated handling are becoming just as important as SMT placement accuracy. This is where the combination of the GAM336AT PCB depaneling machine and the ZM830 Automatic Tray Stacking Machine helps improve line efficiency. 🚗 Why TPMS PCB Production Needs More Automation TPMS boards are small.But production challenges are not. Many factories still face problems such as: In automotive electronics manufacturing, even small interruptions can affect delivery schedules and yield rates. Especially for high-volume sensor products. ⚙️ GAM336AT + ZM830 Integrated Production Workflow The automated workflow combines PCB depaneling, pallet conveying, and tray

How to Reduce PCB Stress in High-Density Assemblies
PCB stress has quietly become one of the biggest reliability risks in high-density assemblies. A board may pass AOI.The solder joints may look perfect.Functional testing may even pass. But hidden mechanical stress inside the PCB can still create long-term failures later. In 2026, this problem is becoming more common because electronics are getting: Components are now placed closer to PCB edges.Multilayer boards are more fragile.And the depaneling processes that worked years ago may no longer be safe enough. For manufacturers working with automotive electronics, medical devices, communication modules, semiconductor systems, or industrial control boards, reducing PCB stress is no longer optional. It directly affects SMT yield and product reliability. 🔍 What Causes PCB Stress in High-Density Assemblies? PCB stress usually
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